Milan Mihajlovic
Manchester University
UK
In this presentation we will give an overview of a finite element based simulator for the analysis of thermal integrity of three dimensional integrated circuits. The motivation and the requirements for fast and accurate thermal analysis have led to the development of this tool which is based on the finite element solution of the non-linear thermal conduction problem. We will present the current capabilities of the tool, the interfaces that allow easy specification of the integrated circuits both at the floorplan and the standard cell level, and simple techniques to reduce problem sizes in the latter case. In the second part of the presentation we will mention the ongoing work which will extend the current capabilities to include microfluidic cooling and external free and forced cooling.